IESA WINWire Nov 10 - Nov 16  2012
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7th Anniversary

IESA Technovation Awards 2012

Technovation Awards - Celebrating Excellence in ESDM’ aim to recognize role models and excellence in the electronics and semiconductor ecosystem. The Awards will honor India’s best individual contributors and organizations that drive the industry forward; and provide them with a platform to showcase their achievements and product successes. Nominations open till November 30, 2012. Click on the link for details

Aadhaar-based cash transfer in 51 districts
Source: Hindustan Times; November 9, 2012

The government will launch direct cash transfer in 51 districts from 1 January and cover the entire country by April 2014, just ahead of the next Lok Sabha elections.

12 of 20 top ranked companies to register sales decline
Source: Electronics; November 10, 2012

GlobalFoundries, Qualcomm, and TSMC expected to register strong double-digit growth this year. A forecasted ranking and discussion of the 2012 top semiconductor suppliers will be included as part of IC Insights' upcoming November Update to The McClean Report.

SoCs make up 80% of next-gen base band processors
Source: EE Times India; November 12, 2012



Base band SoCs are forecast to grow at 108 per cent annually to reach almost 80 per cent of the total base station processors market in 2017, according to ABI Research.ABI Research expects sales of base station processors to grow at 17 per cent annually and reach Rs.5,978.26 crore ($1.1 billion) in 2017 driven by the growth in ......

Qualcomm Grows Where Others Can't
Source: TheStreet; November 12, 2012

In what has been a tough semiconductor market, Qualcomm (QCOM) has continued to confound the skeptics who had rushed to proclaim the end of the chipmaker's growth story.

Audi, NXP sign strategic partnership
Source: Automotive IT International; November 13, 2012

Audi has signed a strategic partnership with semiconductor maker NXP to boost innovation speed and time to market of new automotive electronics applications..

imec Expands Collaboration with TEL on Next-Gen Memory
Source: PCB007; November 13, 2012

imec announced today that Tokyo Electron (TEL), a leading supplier of semiconductor production equipment and imec have further extended their collaboration. The new agreement comprises joint R&D on advanced STT-MRAM (spin-transfer torque magnetoresistive random access memory) within imec's research and development program on emerging memory technologies.

Taiwan Semiconductor Manufacturing: The Winning Streak Continues (TSM)
Source: Delayed Quotes; November 13, 2012


Taiwan Semiconductor Manufacturing (NYSE:TSM) traded today at a new 52-week high of $16.59. This new high was reached on below average trading volume as 7.1 million shares traded hands, while the average 30-day volume is approximately 11.6 million shares.

IBM scores well in top supercomputer rankings
Source: The Poughkeepsie Journal; November 13, 2012

IBM Corp. has scored well on the latest list of the biggest supercomputer around the globe.
Half of the top 10 systems on the Top500 list are IBM Blue Gene Q systems that use Power microchips made at IBM's East Fishkill semiconductor complex.

Analog Devices Introduces Industry's Smallest Isolated DC-to-DC Converters
Source: InfoTECH Spotlight; November 13, 2012

Analog Devices, Inc. (ADI), a global leader in high-performance semiconductors for signal-processing applications and a pioneer in digital isolator technology, today introduced the industry's smallest isolated DC-to-DC converters.

Industry Insight: Global LED Industry
Source: BusinessVibes Blog; November 13, 2012

LED is a kind of semiconductor diode with optical energy of emitting colourful and visible light as well as infrared and ultraviolet invisible light. Compared with small incandescent bulbs and neon lamps, LED is characterized by low working voltage and current, high reliability, long service time, easy adjustment of brightness, thus become widely used all over the world.

IT and Telecom Equipment Move Towards Greener Future
Source: For Press Release; November 13, 2012

Environmental awareness has increased among IT and Telecom equipment companies due to the substantial e-waste generated by these two industries.

Tejas Networks Wins Aegis Graham Bell Award for Innovation in Green Telecom
Source:,; November 14, 2012

Tejas Networks, a leading provider of telecom equipment to leading service providers won the Aegis Graham Bell award for innovation in Green telecom technologies. Mr Sanjay Nayak, MD, CEO and co-founder of Tejas Networks, was also nominated into “T20 of Indian Telecom Industry”, a list of top 20 stars driving the Indian telecom industry. The list was released by Dr Abhijit Gangopadhyay, Dean of Aegis School of Business..

New Intel infrastructure platform set to address telecom equipment manufacturer challenges
Source: WebWire; November 14, 2012

A new infrastructure platform launched by the world’s largest semiconductor chip maker corporation, Intel Corporation, is set to address telecom equipment manufacturer (TEMs) challenges by developing energy-efficient equipment capable of supporting higher traffic that is put through the network core quicker.

Chip market to shrink in 2012, says Gartner
Source: EE Times; November 14, 2012

Gartner has revised downwards its forecast for the global semiconductor market.
The company now sees the market in 2012 being worth $298 billion, a reduction in size of 3.0 percent compared with a market worth $307 billion in 2011. For 2013 Gartner sees growth of 4.2 percent taking the market to $310 billion.

Car industry should benefit from semiconductor economies of scale, NXP suggests
Source: EE Times Automotive; November 16, 2012

In an environment where for cars it becomes essential to be "connected", the automotive industry is confronted with a growing dilemma: The design cycle of everything inside the vehicle that falls under the category "classic car technology" is significantly slower than the design cycle for consumer electronics which are brought into the vehicles by their users.

Communication to IESA Members from Chairman, IESA

Compiled by IESA Research

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