IESA WINWire – March 03 – 09 2012
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New lab positions Singapore as a global leader in semiconductor R&D
Source: Computer World, March 08 2012

3D chip packaging is expected to be a major inflection point for the semiconductor industry, allowing smaller packages, lower power consumption and higher data bandwidth. To cater to the demands of such a rising sector, a new joint R&D centre is being established in Singapore, called the Centre of Excellence in Advanced Packaging at Singapore's Science Park II.

TriQuint Semiconductor Opens International Headquarters in Singapore
Source: Defense Professionals, March 08 2012

TriQuint Semiconductor, Inc., a leading global RF solutions supplier and technology innovator, today officially opened TriQuint International Ptv Ltd, its new International Headquarters in Singapore. The facility will be the focal point for most international customers, suppliers and manufacturing partners.

Equipment Spending Spurt Expected for 2013
Source: Semiconductor packaging news, March 08 2012

Semiconductor fab equipment spending is expected to remain level in 2012 but surge to record levels next year, according to the latest SEMI World Fab Forecast report. Eight companies, including Samsung and Intel, will keep their fab equipment spending level above $2 billion in 2012.

Applied, IME Open $100M 3D Chip Lab in Singapore
Source: Semiconductor packaging news, March 08 2012

Expanding its respective efforts in a hot area, Applied Materials Inc. and the Institute of Microelectronics (IME) have officially opened a 3D chip lab in Singapore at a combined investment of over $100 million. Applied and Singapore’s IME, a research institute under the Agency for Science, Technology and Research (A*STAR), opened the Centre of Excellence in Advanced Packaging at Singapore’s Science Park II.

AMD Goes Fabless
Source: SMR, March 08 2012

In what may be considered a turnaround in its manufacturing strategy, Advanced Micro Devices (AMD) has reworked its wafer supply agreement with GlobalFoundries to effectively do away with its roughly 9% stake in the foundry (valued at $278 million). Investors did not however view the news positively, most likely because of the resultant $703 million it will be taking as charges in the current quarter.

Presidential election years in U.S. influence semiconductor market
Source: Techonline India, March 07 2012

Verbal sparring among political leaders in the U.S. may give the impression that they will be unable to work together even on significant issues, but when an election year comes along it seems the “leaders” put aside many of their differences.

Semiconductor industry to get boost from US$100m research centre
Source: Channel News Asia, March 07 2012

The semiconductor industry is set to get an extra lift from a new US$100 million research centre located at Science Park II. The Centre of Excellence in Advanced Packaging will pioneer an advanced chip technology that will help make mobile devices like smart phones smaller and cheaper. Integrated circuits, or IC chips, are used in mobile phones, tablets or computers.

There's More to Consumer Electronics Than Apple & the iPad
Source: EBN Online, March 07 2012

Tunnel vision is becoming a problem for the electronics industry. One company and a handful of products are dominating discussions in a trillion-dollar market, and this is making it difficult for many industry players, OEMs, component vendors, software vendors, and other third-party services providers to realize potentials for huge sales growth outside of smartphones, tablet PCs, and digital music players.

Micron Announces First 2.5-inch PCIe Enterprise SSD
Source: Bizwire Express, March 06 2012

Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of NAND Flash and advanced solid-state storage solutions, today announced that it has developed a 2.5-inch enterprise solid-state drive (SSD) based on a PCIe interface. The solution combines a high-performance PCIe interface with a hot-swappable 2.5-inch form factor that creates new options for enterprise server performance scalability and serviceability.

Delhi government plans knowledge-based industrial hubs at Baprola, Ranikhera
Source: ASSOCHAM, March 05 2012

The Delhi government hopes to attract investments worth Rs 70,000 crore by 2015 and generate employment opportunities for nearly three lakh people with its knowledge-based industries (KBI) park in Baprola and a multi-level manufacturing / services hub in Ranikhera.

Cadence Appoints Martin Lund to Lead SoC Realization Business
Source: Stock Markets Review, March 05 2012

Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced the appointment of Martin Lund to the position of senior vice president of research and development for the SoC Realization Group, a business which provides differentiated standards-based design intellectual property (IP) and services to the electronics industry.

ARM chip goes to networks from smart phones
Economic Times, March 02 2012

ARM Holdings, whose chip designs are used in most smartphones, is set to power the networks that run them as it steps up competition with Intel in a $9-billion market.

Compiled by IESA Research

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