IESA WINWire –  June 02 - 08 2012
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7th Anniversary

Samsung plans new logic chip line, names new CEO
Source: EE Times India, June 8 2012

http://www.eetindia.co.in/ART_8800668588_1800012_
NT_da6ae172.HTM?click_from=8800094961,9950022552,2012-06-
08,EEIOL,ARTICLE_ALERT

Samsung Electronics plans to invest Rs.9,947.64 crore ($1.9 billion) in a new logic chip line in Korea. The new fab is intended to meet the growing demands for logic products.

Freescale Names Gregg Lowe as President and CEO
Source: SME Channels, June 7 2012

http://www.smechannels.com/news/freescale-names-gregg-lowe-as-
president-and-ceo.aspx

Freescale Semiconductor has named Gregg A. Lowe president and CEO of the company, effective immediately. Lowe comes to Freescale from Texas Instruments where he served as senior vice president and manager of the analog business.

ARM CTO at DAC 2012: The Truth About Semiconductor Scaling
Source: Design & Reuse, June 7 2012

http://www.design-reuse.com/industryexpertblogs/29456/arm-cto-
semiconductor-scaling.html

As process nodes shrink, semiconductor scaling more or less follows the predictions of Moore's Law - but there are some surprising twists and turns. In a keynote speech at the Design Automation Conference (DAC 2012) June 5, Mike Muller, co-founder and CTO of ARM, compared the original ARM1 processor of 1985 to the recent ARM Cortex-M0 microcontroller to show what has and hasn't changed. He also talked about future technologies including 3D stacking.

Vodafone and O2 to pool UK networks
Source: Rethink Wireless, June 7 2012

http://www.rethink-wireless.com/2012/06/07/vodafone-o2-pool-uk-
networks.htm

Major European operators are stepping up their efforts to reduce costs and achieve greater economies of scale, often via partnerships with rivals. The latest development comes in the UK, where the second and third cellcos, Vodafone and Telefonica O2, are to extend their network sharing alliance, to boost efficiency and increase coverage. They also aim to accelerate 4G build-out, meeting the challenge set by Everything Everywhere's aggressive LTE plans.

IP core for interfacing 3D integrated semiconductor memory devices
Source: EE Herald, June 7 2012

http://www.eeherald.com/section/news/nws20120607b3.html

VLSI design services company Open-Silicon has made available Hybrid Memory Cube (HMC) controller IP core for interfacing semiconductor memory devices such as flash, DRAM and SRAM on 3 dimensionally built Hybrid Memory Cube (HMC). HMC controller IP core is based in high-bandwidth serial protocols derived from Open-Silicon's Interlaken controller IP core.

Samsung Elec moves CEO, seen grooming next leader
Source: Reuters, June 7 2012

http://in.reuters.com/article/2012/06/07/samsung-ceo-
idINDEE85608W20120607

Samsung Electronics Co, Asia's technology powerhouse battling Apple for smartphone supremacy, is shifting its CEO to a new role as the family-run parent company prepares to transfer ownership control to a third generation.

Sasken Communication Releases Automotive Infotainment Solution
Source: Indian Commodity, June 7 2012

http://www.indian-commodity.com/top-news/sasken-communication-
releases-automotive-infotainment-solution.aspx

Sasken Communication Technologies, a global leader in embedded technologies, expanding its area of focus into newer industries like automotive infotainment and consumer electronics, has released an Automotive Infotainment solution, optimized on the Jacinto platform from Texas Instruments Incorporated (TI).

Wipro partners with SAP to launch 'Wipro m-eXecute'
Source: Money Control, June 7 2012

http://www.moneycontrol.com/news/press-release/wipro-partnerssap-to-
launch-wipro-m-execute-_714846.html

Wipro Technologies, (NYSE: WIT) the Global Information Technology, Consulting and Outsourcing business of Wipro Limited today announced the launch of ‘Wipro m-eXecute’. Wipro m-eXecute is the first ever mobility app for the manufacturing sector, developed in collaboration with SAP and caters to the niche space of manufacturing operations.

Govt hires Accenture to review semiconductor fab proposals
Source: EE Times India, June 6 2012

http://www.eetindia.co.in/ART_8800668418_1800007_
NT_2610e64f.HTM?click_from=8800094879,9950022552,2012-06-
06,EEIOL,ARTICLE_ALERT

IT services company Accenture said it has been selected by the Department of Electronics & Information Technology (DeitY) to review investment proposals from global technology providers and investors interested in building semiconductor fabrication units (fabs) in India.

ROHM Semiconductor Introduces a Broad Line-up of Li-ion Battery Protection ICs
Source: Automotive Electronic Specifier, June 6 2012

http://www.automotive-electronicspecifier.com/Components/ROHM-
Semiconductor-Introduces-a-Broad-Line-up-of-Li-ion-Battery-Protection-
ICs.asp

ROHM Semiconductor introduces a broad line-up of ICs providing all functions needed for controlling, monitoring and protecting systems using multiple-cell series-connected Li-ion battery packs. These rechargeable battery packs are commonly used in hybrid electric vehicles or electric vehicles (HEV/EV), Power Tools and E-Bicycles, application areas which are expected to rapidly grow over the next few years.

London 2012 Olympic Games to benefit from machine-to-machine (M2M) communications
Source: Telit Media, June 6 2012

http://www.telit.com/en/discover/telit-media-center/press-
releases.php?p_id=283&p_anz=show&n_id=217

Alexander Dennis (ADL) the UK's largest bus and coach manufacturer, has announced that Traffilog, a leading web-based telematics provider, will be installed in their public service vehicles in time for the 2012 Olympic Games. Traffilog has also been selected by Kings Ferry, the prestigious UK coach operator, to secure its fleet of coaches they are supplying for the police and VIPs during the Games.

Qualcomm and DoCoMo take different views on LTE roaming
Source: Rethink Wireless, June 6 2012

http://www.rethink-wireless.com/2012/06/06/qualcomm-docomo-views-lte-
roaming.htm

One of the biggest challenges to international LTE services is the fragmentation of the spectrum bands used for the networks, and consequent problems for roaming. Operators and vendors are seeking to mitigate the effects, with Qualcomm developing a chipset which supports no fewer than seven bands. Meanwhile NTT DoCoMo, always an influential carrier on standards developments, believes the best way is to rely heavily on existing frequencies.

TSMC, Samsung to manufacture semiconductors for other firms
Source: The Gulf Today, June 5 2012

http://gulftoday.ae/portal/0bdc14bd-496c-46ad-8e73-aef3f84fdcd5.aspx

Morris Chang, the father of Taiwan’s chip sector, once shrugged off Samsung Electronics’ entry into the foundry business - making private-label semiconductors under contract for others. Now, he calls the South Korean group the industry’s ‘700-pound gorilla’ with formidable financial firepower.

Ricoh Innovations President and CEO Dr. Nikhil Balram Honored With a 2012 Fellow Award by the Society for Information Display
Source: Bizwire Express, June 5 2012

http://www.bizwireexpress.com/showstoryINPR.php?storyid=266847

Ricoh Innovations, Inc. ("RII"), a Silicon Valley-based subsidiary of Ricoh Company, Ltd., which develops innovative technologies and new business opportunities for Ricoh, today announced that its president and CEO Dr. Nikhil Balram will be recognized by the Society for Information Display (SID) with a 2012 Fellow Award for outstanding contributions to the display industry. Dr. Balram will receive the award at a banquet held this evening during Display Week, SID's annual International Symposium, Seminar and Exhibition, running June 3-8, 2012 at the Boston Convention and Exhibition Center.

Corning Launches Ultra-Slim Flexible Glass
Source: IT News Online, June 5 2012

http://www.itnewsonline.com/showbwstory.php?storyid=7482

Corning Incorporated (NYSE: GLW) has announced the launch of Corning® Willow™ Glass, an ultra-slim flexible glass, which could revolutionize the shape and form of next-generation consumer electronic technologies. The company made the announcement today at the Society for Information Display’s Display Week, an industry tradeshow in Boston.

Cavium signs pact with Institute for Information Industry (III) of Taiwan
Source: Telecom Lead, June 5 2012

http://telecomlead.com/inner-page-details.php?id=9555&block=Tower

Cavium, a provider of highly integrated semiconductor products that enable intelligent processing for networking, communications and the digital home, announced partnership with the Institute for Information Industry (III) of Taiwan, to develop a total out-of the-box hardware and software solution for Taiwan's wireless systems vendors.

UK funds compound semiconductor R&D projects
Source: Semiconductor Today, June 5 2012

http://www.semiconductor-
today.com/news_items/2012/JUNE/TSB_050612.html

Following opening of the competition last Autumn and closing for applications in December, the ‘Technology Inspired Innovation’ competition for collaborative research & development funding in the UK has now resulted in 43 projects being chosen for funding, of £250-500,000 each. Up to £15m comes from the Technology Strategy Board (TSB, the UK government’s national innovation agency), while up to £2.75m comes from the economic development agency Scottish Enterprise.

Save IT hardware industry, urges MAIT
Source: EETimes India, June 5 2012

http://www.eetindia.co.in/ART_8800668304_1800007_
NT_9a3019db.HTM?click_from=8800094835,9950022552,2012-06-
05,EEIOL,ARTICLE_ALERT

The Manufacturers' Association of IT (MAIT) has urged Government to address critical challenges faced by the Indian hardware industry due to existing foreign exchange volatility.

Freescale introduces three reference designs to help redefine battery charging
Source: TechOnline India, June 4 2012

http://www.techonlineindia.com/article/12-06-
04/Freescale_introduces_three_reference_designs_to_help_
redefine_battery_charging.aspx

Freescale Semiconductor has announced three reference designs for wireless charging - for tablets, smart phones and multi-cell battery packs - that it said could change the way consumers power their energy-hungry devices.

@ The ConFab: Semiconductor industry experts look to the future
Source: Solid State Technology, June 4 2012

http://www.electroiq.com/articles/sst/2012/06/the-confab-semiconductor-
industry-future.html

The ConFab’s sessions opened with “The Economic Outlook for the Semiconductor Industry,” featuring Jackie Sturm of Intel, Dan Hutcheson of VLSIresearch, and Jim Feldhan of Semico. The ConFab is an invitation-only meeting of the semiconductor industry, taking place this week in Las Vegas.

Chip shaker: TSMC, Samsung to flex foundry muscle
Source: Reuters, June 3 2012

http://www.reuters.com/article/2012/06/03/us-asia-chips-foundries-
idUSBRE8520ER20120603

Morris Chang, the father of Taiwan's chip sector, once shrugged off Samsung Electronics' entry into the foundry business - making private-label semiconductors under contract for others. Now, he calls the South Korean group the industry's "700-pound gorilla" with formidable financial firepower.

Compiled by IESA Research

research@isaonline.org

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