IESA WINWire – April 28 – May 4 2012
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IET Enters Into A Partnership With India Electronics & Semiconductor Association
Source: EFY, May 4 2012

The Institution of Engineering and Technology (IET), one of the world’s largest multi-discipline, professional societies for engineers and technicians, announced its partnership with the India Electronics & Semiconductor Association (IESA)

STMicroelectronics, RealVNC integrate phone apps at the wheel
Source: Telecom Tiger, May 4 2012

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a leading provider of semiconductors for car infotainment, has integrated remote control technology from RealVNC, the original inventor and provider of VNC, onto ST’s automotive grade infotainment application processors.

Manufacturing very important to India: Willy C Shih
Source: The Economic Times, May 4 2012

The world of manufacturing is changing. Globalisation and technological shifts is changing the order in the manufacturing world. Few understand it better than Willy C Shih, the professor of management at Harvard Business School. Prior to joining HBS, Shih has spent 28 years in IT and consumer electronics industry and now teaches technology and operations management at HBS besides other subjects.

IDT Acquires Fox Electronics
Source: Press Trust, May 4 2012

Integrated Device Technology, Inc. (IDT) (NASDAQ: IDTI), the Analog and Digital Company delivering essential mixed-signal semiconductor solutions, today announced that it has acquired Fox Electronics, a leading global supplier of frequency control products (FCPs), in an all-cash transaction for approximately $30 million, of which $26 million was paid at closing. Fox Electronics revenue was approximately $23 million in calendar year 2011, and the company is profitable.

Now, drones to keep eye on trouble-makers in crowd
Source: Zee News, May 4 2012

Eyebot drones, the latest in surveillance technology, would promptly spot mischief makers during major sporting or social events, or act as high-resolution 3D street imaging systems, according to its developers.

MediaTek plans to shift some projects to India from Taiwan
Source: Telecom Lead, May 3 2012

Chip major MediaTek is planning to shift some of the existing and new projects to India from Taiwan, where it is headquartered.

GlobalFoundries announces 3D chip stacking at 20nm
Source: EE Times India, April 30 2012

GlobalFoundries has begun installation of a special set of production tools to create Through-Silicon Vias (TSVs) in semiconductor wafers processed on the company's 20nm technology platform at Fab 8.

India to get its first wafer fab facility in 2 years
Source: CIOL, April 30 2012

The Union Government is going to set up a committee which will identify and assess the potential investors for semiconductor wafer fabrication and recommend the right investor, who had proposed for establishing semiconductor wafer fabrication facilities in India.

Open-Silicon Expands Semiconductor Design Solutions
Source: SOC Central, April 30 2012

Open-Silicon, Inc. has further expanded its comprehensive solutions offering for semiconductor and system companies to include architectural analysis and modeling, pre-silicon prototyping, embedded software, co-silicon system design and test, and post-silicon validation. With the expanded solutions offering, Open-Silicon has enabled its customers to benefit from greater customization and deeper partnership throughout the product development process.

Govt wants 'Made in India' PCs
Source: Times of India, April 30 2012

Want orders? Must invest. It's a tried-and-trusted formula of many policymakers, including those in India, to woo investors. In the Indian defence sector, for example, foreign companies are bound by what are called offset obligations, which require them to procure a part of the equipment from local suppliers. The aim is to boost the domestic arms industry.

GlobalFoundries announces 3D chip stacking at 20nm
Source: EE Times India, April 30 2012

GlobalFoundries has begun installation of a special set of production tools to create Through-Silicon Vias (TSVs) in semiconductor wafers processed on the company's 20nm technology platform at Fab 8.

Fujitsu Names Satoru Yamaguchi as President and CEO of Fujitsu Semiconductor Wireless Products
Source: Electro IQ, April 28 2012

Fujitsu Semiconductor Wireless Products (FSWP) announced that Satoru Yamaguchi has been named president and chief executive officer effective April 2. He replaces the retiring Yutaka Suzuki.

Samsung unveils the SE-218BB, world’s thinnest DVD writer for ultrabooks and tablets
Source: Tech, April 28 2012

Samsung likes having 'the world’s first' attached to their products and this time around it is no different. The brand's recently taken the wraps off their new slim external DVD writer, the SE-218BB optical disc drive (ODD) that sets the industry standard for ultra portable drives. Commenting on the announcement of the product, Samsung states, “With its ultra small footprint, consumers will appreciate the SE-218BB sleek drive as an ideal companion for ultrabook users that quickly connects and is USB powered to access content wherever they are”

Andhra to unveil new electronic hardware policy
Source: igovernment, April 27 2012

Now the electronic hardware industry in Andhra Pradesh will be able to avail the general incentives under the ICT Policy, according to the draft Andhra Pradesh Electronics Hardware Policy 2012-2017.

Taiwan Semiconductor is the world's largest semiconductor foundryt
Source: Alacrastore, April 27 2012

Taiwan Semiconductor Manufacturing is by far the largest contract semiconductor manufacturer, or foundry, with almost 50% market share (according to Gartner s March 2012 data). We believe the company is the best in its business because of the narrow moat it derives from its scale advantages.

Please note : Due to unavoidable reasons, the WINWire dated Apr 28 – May 4 is being sent out today.

Compiled by IESA Research

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