IESA WINWire – April 21 – 27 2012
for Subscription click here  

Aakash II: DataWind inks deal with VMC
Source: CIOL, April 26 2012

After much hullabaloo with Quad Electronics over services breach and payment row, Datawind, the maker of Aakash tablets, has now roped in Hyderabad-based VMC Systems for the rollout of Ubislate 7 aka Aakash II tablets.

Government to shortlist firms for silicon wafer fab facility
Source: Projects Today, April 26 2012

The Central Government is likely to shortlist companies that have evinced interest in setting up semiconductor wafer fabrication facilities in the country.

Forus Health Raises $5 Million from IDG Ventures India and Accel Partners
Source:, April 26 2012

Bangalore-based affordable medical technology and solutions company Forus Health Pvt. Ltd. (Forus) has successfully raised Series A funding of $5 million from two leading venture capital funds, Accel Partners and IDG Ventures India. Unitus Capital was the sole advisor to Forus for the transaction. This is a big news for the Healthcare Startup Eco-system in India and validates the innovation which Forus has brought in our market. Leveraging Cloud, Tele-medicine and Data Center facilities, Forus represents the coming of age of the Web 2.0 version of Indian Healthcare.

Xilinx announces new IP and system-centric design environment, Vivado
Source: Tech Online India, April 26 2012

Xilinx has announced the Vivado Design Suite, a new IP and system-centric design environment to speed up design productivity for the next decade of ‘All Programmable’ Devices.

Researchers now develop liquid solar cells
Source: Bangalore Mirror, April 26 2012

Scientists and engineers at the University of Wisconsin-Milwaukee (UWM) have discovered an entirely new carbon-based material, synthesised from graphene, which can act as a semiconductor.

AP policy on e-hardware industry in 2 months
Source: Hindu Business Line, April 25 2012

The Andhra Pradesh Government will come out with a five-year Electronics Hardware Policy in two months. The draft policy for 2012-17, being circulated among stakeholders for their feedback, calls for exemption of the industry from power cuts.

DARPA, chipmakers seek partners to develop ultrafast, supersmart semiconductors
Source: Next Gov, April 24 2012

A consortium of chip makers and the Defense Advanced Research Projects Agency are seeking partners to build ultrafast semiconductors that could make use of nanotechnology and quantum engineering, according to a grant document.

Rs 10,000-cr incentive package for electronics manufacture on the anvil
Source: Hindu Business Line, April 23 2012

The Government is formulating a special incentive package to encourage local manufacturing of electronic goods including mobile handsets, semiconductor wafer fab, consumer electronics and telecom network equipment.

Indian semicon industry is at inflection point
Source: India Electronic News, April 23 2012

With India at the cusp of a third telecom revolution following the expected roll out of Long Term Evolution (LTE) networks to offer broadband wireless services and ensure last mile connectivity, the semiconductor industry is poised for a huge growth in 2012, as domestic telecom equipment vendors firm up plans to enhance production to meet the growing local demand.

200 Electronic Manufacturing Clusters by 2020, to Employ Around 28 Million People: Sibal
Source: India Electronic News, April 23 2012

The Minister of Communications & IT Sh Kapil Sibal has said that India’s Electronic Sector aims to achieve a turnover of about USD 400 Billion , involving investment of about USD 100 Billion and employment to around 28 million, by 2020. He said it is proposed to set up over 200 Electronic Manufacturing clusters and significantly upscale high-end human resource creation to 2500 PhDs annually by 2020 in the sector.

First Intel-Inside phone hits Indian stores
Source: EE Times India, April 23 2012

Intel in partnership with handset manufacturer Lava International announced the launch of first smartphone with Intel Atom inside, in India. The Xolo X900 will be available for purchase beginning April 23 at a street price of Rs 22,000.

Automotive infotainment platforms: A promising idea for semiconductor companies
Source: Tech Online India, April 23 2012

Semiconductor firms with the ability to scale internal automotive expertise or collaborate quickly with the right partners can capitalize on the opportunity and address associated challenges cost effectively and efficiently.

Emcore wins $6M contract to design solar panels for spacecraft
Source: EE Times, April 23 2012

Compound semiconductor vendor Emcore Corp. (Albuquerque, New Mexico) announced it has signed a $6 million contract with Ball Aerospace & Technologies Corp. (Boulder, Colorado) to design, manufacture, test and deliver solar panels for a new spacecraft.

Toshiba to Build New Semiconductor Facility in Thailand
Source: OTC Markets, April 23 2012

Toshiba Corporation (TOKYO: 6502) today announced that it will rebuild its semiconductor manufacturing operations in Thailand by relocating Toshiba Semiconductor Thailand Co., Ltd. (TST) to a new manufacturing facility. The move will position the company to meet future growth in demand and replace the factory inundated by the 2011 floods.

Prospects brighten for silicon wafer fab units as global firms offer support
Source: Hindu Business Line, April 22 2012

The Government's effort to set up semiconductor wafer fabrication units is finally making some headway. At least five global semiconductor makers have expressed interest in supporting the project in some way or the other. They include Infineon Technologies, ST Microelectronics, Russian major Sitronics, GlobalFoundries and a consortium comprising Jaypee Associates, IBM and Israeli firm Tower Jazz.

Chip lets smartphones see through walls, clothes
Source: NDTV Gadgets, April 21 2012

Researchers at a Texas university have designed a chip that could give smartphones the long-envied ability of comic book hero Superman to see through walls, clothes or other objects.

Broadcom launches affordable cable STB to accelerate digitization
Source: India Infoline, April 20 2012

Broadcom’s technology is designed for India’s growing cable TV market including 94 million subscribers and 95 percent of whom still use legacy analog networks. Broadcom Corporation , a global innovation leader in semiconductor solutions for wired and wireless communications, today announced the industry’s most integrated single chip BCM7014 standard definition (SD) cable set-top box (STB) system-on-a-chip (SoC) solution.

Freescale collaborates with BIT, Mesra
Source: Electrical Monitor, April 20 2012

Freescale Semiconductor India Pvt Ltd has collaborated with BIT (Birla Institute of Technology), Mesra to set up a new laboratory (Embedded System Laboratory). The specialised laboratory was inaugurated on March 17, 2012 at the hands of Dr. P. K. Barhai, Dean, Faculty and Sponsored Research, BIT, Mesra, at Ranchi in Jharkhand..

Compiled by IESA Research

The IESA WINWire is available on the IESA website, To receive IESA WINWire or be removed from our distribution list, email  with "Subscribe" or "Unsubscribe” in the subject box.

All information provided in this document is of a general nature and is not provided with any warranty as to its suitability to the circumstances of each individual business. Readers and users are entirely and individually responsible for taking appropriate action with regard to the setting up of such services and for the consequences of such actions. As per Copyrights Act, 1957 (“Act”) : Publishing articles which contain extracts from other works and providing the source of such extracts will not be an act of infringement of copyrights.

Copyright © 2007, I
ndia Electronics & Semiconductor Association


India Electronics & Semiconductor Association
Head office: UNI Building, Millers Tank Bund Road, Bangalore - 560 052 India Phone: +91 80 4147 3250 Facsimile: +91 80 4122 1866
New Delhi office: DBS Business Centre, First Floor World Trade Tower, Barakhamba Lane Connaught Place, New Delhi - 110 001 India