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ISA WINWire January 07-13 2012
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CES 2012: Gadgets and more

Source: EE Times India, January 12 2012

http://www.eetindia.co.in/ART_8800659404_1800005_NT_3c3fc5f2.HTM?click_from=8800089494,8938164566,2012-01-13,EEIOL,ARTICLE_ALERT

Consumer Electronics Show (CES) 2012 opened with a bang, starting with CES Unveiled last Sunday, January 8, playing host to several innovations from companies. Here are some attention-grabbing gadgets that we found interesting. SolarKindle, the first cover of its kind, acts as an external battery that charges up the Kindle on the go through solar power.

Automotive Semiconductors Market to 2015 - Demand for Energy Efficient Vehicles with Safety and Comfort Systems to Drive Sales Growth

Source: PRNewswire, January 12 2012

http://www.mediawebsite.net/danews/story/?catSetID=7007&catID=290397&nrid=137172468&page=1

GBI Research's new report, "Automotive Semiconductors Market to 2015 - Demand for Energy Efficient Vehicles with Safety and Comfort Systems to Drive Sales Growth" provides key information and analysis on the market opportunities in the automotive semiconductors industry. The report covers the industry dynamics, information on the revenue and volume of the Automotive Semiconductors Market, and the market share of the suppliers. The report also provides product - based, region-based and end-use based forecasts up to 2015. The product based forecasts up to 2015 are given for the microcontrollers (MCUs), power semiconductors, ASICs, sensors, discretes and memory. The market for automotive semiconductors applications in powertrain, infotainment, chassis and safety, and, comfort systems and body electronics are discussed.

Intel muscles into smartphones, tablets

Source: EE Times, 11 2012

http://www.eetimes.com/electronics-news/4234530/Intel-muscles-into-smartphones--tablets?cid=NL_CES_20120112

Intel Corp., the 800-pound gorilla of the semiconductor market, has finally entered the wireless court. After years of trying, the company said its processors will be designed into smartphones and tablet PCs at three of the world's leading OEMs.

Samsung launches GalaxyTab 620 tablet for Rs 30k

Source: Andhra Business Bureau, January 11 2012

http://www.andhrabusiness.com/NewsDesc.aspx?newsID=Samsung-launches-GalaxyTab-620-tablet-for-Rs-30k.html

Mobile device maker Samsung Electronics on Wednesday announced the launch of Samsung GalaxyTab 620 built on Android Honeycomb 3.2 platform with 1.2 GHz dual core processor at a price of Rs 30,250. "The GalaxyTab 620 with its powerful processor, next generation OS, stylish design and intelligent value added applications make this a faster, lighter and smarter device," Samsung India's Country Head for Mobile and IT, Ranjit Yadav said in a statement.

DSP Group Chipset Solution Powers Huawei Device's Innovative Fixed Wireless Telephone

Source: BizWire Express, January 11 2012

http://www.bizwireexpress.com/showstoryGNW.php?storyid=267714

DSP Group(R), Inc. a leading global provider of wireless chipset solutions for converged communications at home, and Huawei Device, a leading global information and communications technology (ICT) solutions provider, announced that DSP Group's XceedR(TM) digital cordless chipset solution is powering the new Huawei F685 3G DECT Digital Cordless Phone. Operating as a regular cordless home phone, the F685 connects calls over a 3G network rather than a telephone jack. This outcome is part of the companies' joint effort to enable mobile operators to offer a new array of voice and value-added services (VAS) to home subscribers.

Qualcomm pushes into smart TVs and W8 slates

Source: Rethink Wireless, January 10 2012

http://www.rethink-wireless.com/2012/01/10/ces-qualcomm-pushes-smart-tvs-w8-slates.htm

Qualcomm has been making a host of announcements at Consumer Electronics Show, as it stretches beyond its mobile heartland into the CE market and, via its Atheros subsidiary, the digital home. The company demonstrated its Snapdragon processor running in a Windows 8 tablet and a Lenovo television, as CEO Paul Jacobs emphasized the expanding reach of the chip, and the new opportunities that lie in emerging markets.

Consolidated R&D expense was $1.8 bn in 2010' -Rajiv Kapur, managing director, Broadcom India

Source: Voice & Data, January 10 2012

http://voicendata.ciol.com/content/speak/112011004.asp

We are a dominant player in the industry; our diverse products and constant innovations in the product range is our competitive edge. Broadcom is a pioneer in mixed-signal design and single-chip integration. Besides this, we have the broadest product portfolios of wired and wireless connectivity solutions. And we are the market leader in set-top box, bluetooth, switching, blu-ray, radio combos, wireless LAN, and broadband modems. Broadcom offers solutions in all these segments, from home to enterprise to infrastructure to on-the-go products.

KPIT Cummins Infotainment Platform Achieves GENIVI Compliance

Source: Techwhack, January 10 2012

http://press-releases.techwhack.com/155393-kpit-cummins-infotainment-platform-achieves-genivi-compliance/

KPIT Cummins (BSE: 532400; NSE: KPIT), a global leader in product engineeringsolutions for automotive industry, today announced that its In-Vehicle Infotainment (IVI) platform is now compliant with GENIVI Compliance Specification Release 1.0. Automotive OEMs are aggressively pursuing the adoption of consumer electronics (CE) features in infotainment. KPIT’s infotainment platform speeds up this process by leveraging the critical mass of open source community, which enables broader coverage and faster support of new CE technologies.

IBM and GLOBALFOUNDRIES Begin First Production at New York's Latest Semiconductor Fab

Source: BusinessWire, January 09 2012

http://gadgets.tmcnet.com/news/2012/01/09/6041962.htm

GLOBALFOUNDRIES and IBM today announced an agreement to jointly manufacture advanced computer chips at both companies' semiconductor fabs in New York's "Tech Valley." The new products recently began initial production at IBM's 300mm fab in East Fishkill and GLOBALFOUNDRIES' Fab 8 in Saratoga County, and are planned to ramp to volume production in the second half of 2012. The chips are the first silicon produced at GLOBALFOUNDRIES' newest and most advanced manufacturing facility.

Lattice Semiconductor and Aptina Announce Dual Image Sensor Stereo Camera Reference Design for CES 2

Source: BusinessWire, January 06 2012

http://pr-usa.net/index.php?option=com_content&task=view&id=1027033&Itemid=29

Lattice Semiconductor Corporation in collaboration with Aptina, today announced that it will be demonstrating a low cost, dual image sensor design at the Consumer Electronics Show (CES) in Las Vegas, January 10-13, 2012.

Compiled by ISA Research

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