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ISA WINWire - February 8 - 17 2012
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To have or not to have a fab in India

Source: EE Times, February 17 2012

Several weeks back, a Palo Alto-based venture capitalist specializing in semiconductors said partnering with Israel rather than with U.S. or Taiwanese companies would be a great idea. Whether or not the investor was aware of Tower Semiconductors’ plans for a 300-mm fab in India is now a moot point.

Carlyle looking to raise $10 bln for new fund - Fortune

Source: Reuters, February 17 2012

The Carlyle Group is looking to raise $10 billion for its next North American private equity fund, Fortune magazine said in a report on its website.

RF Micro Devices(R) Announces Retirement of Robert Van Buskirk

Source: Bizwire Express, February 16 2012

RF Micro Devices, Inc. (Nasdaq:RFMD), a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today announced the retirement of Bob Van Buskirk, corporate vice president of RFMD's Compound Semiconductor Group (CSG).

TowerJazz with its local partner bids for 'India semiconductor chip fab

Source: EE Herald, February 16 2012

Israel based semiconductor foundry service provider TowerJazz has announced that it has signed a binding MOU with a leading Indian infrastructure conglomerate, to build and operate a 300mm chip fab facility in India. The release states this will enable the company a roadmap to long term 300mm wafer size, 90nm analog technology and companion chips in deep submicron technologies (65-45nm).

Mobile payment drives NFC market

Source: EETimes India, February 16 2012

According to MarketsandMarkets, near field communication (NFC) market is predicted to reach Rs.51,020.41 crore ($10 billion) with CAGR of 38 per cent from 2011 to 2016 featuring applications such as access control, ticketing, data sharing and advertising. The research firm cites mobile payment application as the most attractive application of NFC technology. It includes both, in-store payment and on-line payment. It is expected to cannibalise the smart cards market for cashless payments, added the market research firm.

Bridging software and hardware to accelerate SoC validation

Source: Tech Online India, February 16 2012

As the complexity of systems-on-chip (SoCs) continues to increase, it is no longer possible to ignore the challenges caused by the convergence of software and hardware development. These highly functional systems now include a complex mix of software, firmware, embedded processors, GPUs, memory controllers, and other high-speed peripherals. This increased functional integration, combined with faster internal clock speeds and complex, high-speed I/O, means that delivering a functional and fully validated system is harder than ever.

Tablet screen size: not one-for-all is market opportunity

Source: EE Herald, February 15 2012

The immediate opportunity now in smart phones and tablet devices is customizing the device for different users. At recently concluded India Semiconductor Association's Vision Summit 2012 event, Sanjay Gupta, Senior VP of Wipro Technologies was explaining how they are designing different smart-phone user interface for office user, elderly person, students etc. It looks the screen-size-needs and also the applications-needs are different for an each set of users, if not for an every individual.

Padma Rao Joins Foundation Capital as Entrepreneur in Residence

Source: PressTrust, February 14 2012

Foundation Capital today announced Padma Rao will join the firm as an Entrepreneur in Residence (EIR). Rao comes from Zynga, where she built the companys marketing practice from 2009 to 2011. In addition to having experience in marketing, Rao has also held several engineering roles at Alcatel-Lucent, Calix Networks and Georgia Tech Research Institute.

IBM chip fab club to talk on deeper nodes such as 14nm on Mar 14

Source: EE Herald, February 14 2012

The semiconductor chip fab tech partners IBM, Samsung Electronics and GLOBALFOUNDRIES are going to preview the future of semiconductor technology at the 2012 Common Platform Technology Forum to be held at the Santa Clara Convention Center on March 14.

Maskless lithography: a better alternative in semiconductor chip fab tech

Source: EE Herald, February 13 2012

Due to the ultra-complexity of the present multi-mask lithography based IC fab tech, its natural for a semiconductor fabrication expert to think about modulating the light beam in 3axis rather than using multiple number of photo masks to print patterns on photoresistive material to etch the semiconductor material with gate, drain and source terminals of MOSFET. If the beam is moved on the silicon at nano meter scale very fast, so that the number of wafers handled is as good as mask type lithography, it makes sense for mass adoption of maskfree lithography. In fact the light beam is no more viable and is replaced with electron-beam in maskless lithography, electron beam's x,y,z coordinates can be better controlled electrically than a light beam. It's like controlling the electron beam in cathode ray tube where the beam hits the big phosphor screen. The similar technique is applied to chip making, where the electron beam is moved over small area of silicon in nano meter (nm) scale.

Thin dielectric film depositing m/c to make NAND flash memory chips below 20nm

Source: EE Herald, February 13 2012

The NAND flash memory semiconductor devices to pack more density are going for vertical integration. The tech is called vertically integrated memory (VIM). When th integration is in z direction, the process need laying of up to 64 dilectric films in vertical direction to lessen the cross talk across adjacent memory cells.

Joining the electronics hardware game: better late than never

Source: The Hindu, February 12 2012

The much-awaited and much-delayed national policy on electronics has not yet been announced, but the key elements of a new strategy to reduce the country's overwhelming dependence on imports emerged earlier this week when the top leadership of the Ministry of Communications and Information Technology assembled in Bangalore at the Vision Summit organised by the India Semiconductor Association (ISA).

Ittiam- InterDigital solution will reduce Wi-Fi congestion

Source: India Tech Online, February 10 2012

Bangalore-based embedded solutions provider Ittiam Systems’ mobile Wireless LAN platform, coupled with a dynamic spectrum management solution from US-based wireless technology leader, InterDigital, will help service providers harness the so-called TV White Space and other under-utilised telecom spectrum to reduce WI-Fi network congestion.

ESDM to Benefit from LTE

Source: Communications Today, February 09 2012

"Mobile handset manufacturers including branded OEMs for LTE compatible handsets, chipsets, telecom equipment vendors, network providers, software solution providers, content and media providers, and mobile download providers will benefit from the rollout of LTE networks." PVG Menon, President, India Semiconductor Association

Funds, policy to boost electronic manufacturing

Source: Machinist 360, February 08 2012

Electronic Systems Design and Manufacturing (ESDM) industry will receive boost along the domestic front as the Indian government has embraced a multi dimensional approach to drive the sector’s growth. India's ESDM industry is projected to touch a landmark figures of US$400 billion by 2020, but the present level of domestic production has raised speculations that the country's import of electronics will potentially exceed its oil bill. Annually, India contributes US$2 billion in chip designing.

Compiled by ISA Research

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