Please click here if you are not able to view this emailer
ISA WINWire December 31 2011 - Jan 06 2012
for Subscription click here

Marvell's Armada-based Foresight Platform to power Google TV

Source: EE Times, January 05 2012

Marvell Semiconductor Inc. has announced that its Armada-based “Foresight Platform” is to power the next generation of Google TV. Powered by the Marvell Armada 1500 HD Media System-on-a-Chip (SoC), the fanless, near silent Foresight Platform was purportedly chosen for its ability to deliver 3D video, rich audio, 3D graphics and TV-friendly Web content, while also sporting cell-phone like power management features.

Broadcom Launches First Gigabit Speed 802.11ac Chips — Opens 2012 CES with 5th Generation (5G) Wi-Fi Breakthrough

Source: IT News online, January 05 2012

Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today introduced its first family of 802.11ac (5G WiFi) chips designed for a broad range of product segments. The new IEEE 802.11ac chips are three times faster and up to six times more power efficient than equivalent 802.11n solutions.

New 28nm platforms: Transforming Asia from world's factory to global R&D hub

Source: EE Times Asia, January 05 2012

With almost 4 billion people, Asia is home to 60 percent of the world's population. In today's global electronics market place, it has not only become a key driver of consumer demand but is rapidly transforming from the "world's factory" into a global hub for R&D, high-end manufacturing and services.

EnSilica opens design centre in Bangalore

Source: EE Times India, January 05 2012

EnSilica, a provider of IC design services and system solutions, has opened a new design centre in Bangalore, India. The new design centre will be a centre of excellence for the advanced verification of complex semiconductor products and IP, according to the company.

Researchers develop high-efficiency thin-film semiconductors

Source: Plus Plastic Electronics, January 04 2012

Researchers have developed a new high-performance thin-film capacitor, which could aid the transition to printed electronics. A team from the International Centre for Materials Nanoarchitectonics and the National Institute for Material Science in Japan uses a new high-permittivity dielectric sheet stacked on an atomically thin SrRuO3substrate.

Semiconductors Can Address The World's Energy Crisis

Source: Forbes, January 04 2012

What happens when an unstoppable force meets an immovable object is a question that has perplexed many philosophers for thousands of years. Today, this classic paradox makes a good metaphor for one of the world’s most important issues. The “unstoppable force” is the continually increasing worldwide demand for energy. The “immovable object” is the world’s rapidly diminishing fossil-fuel reserves and the growing acceptance that burning these fuels is causing climate changes that will have profoundly negative effects on future generations.

New Manufacturing Tech Could Mean Cheaper Solar Cells

Source: Technology Review India, January 03 2012

A novel way to make thin, uniform coatings developed at Rice University could reduce the cost of making conventional silicon solar cells, and could open the way for new kinds of solar cells that are far more efficient or cheaper than conventional ones.

Power Semiconductors: Made in Germany

Source: Power Systems Design, January 02 2012

Today’s challenge to support the world with clean green energy in the near future has brought wind- and solar power generation stronger into focus. Now, windmills have grown to output powers of several megawatts and solar arrays in an equally demanding power range have been set up throughout the world, relying on power semiconductors “made in Germany”.

ASIX Releases the World's First Single-Chip USB 3.0 to Gigabit Ethernet Controller

Source: Design & Reuse, January 02 2012

ASIX Electronics Corp., a leading fabless semiconductor company for embedded networking/bridging solutions, announced today the AX88179, the world's first USB 3.0 to Gigabit Ethernet controller which integrates USB 3.0 PHY and 10/100/1000Mbps Gigabit Ethernet MAC/PHY in a single chip. The AX88179 is the latest addition to ASIX's USB-to-LAN product portfolio, providing a small form factor solution and plug-and-play usability, enabling embedded system designers to deliver Gigabit Ethernet connectivity while leveraging the growth and speed of USB 3.0 SuperSpeed technology.

Semiconductor industry hopes National Policy will help create ecosystem

Source: Hindu Business Line, December 30 2011

The who's who of the semiconductor industry will gather in Hyderabad in the second week of New Year to discuss the most promising area for the industry in the coming decade. The theme of the five-day conference is embedded solutions for emerging markets. This captures the mood of Indian semiconductor industry that is attempting to create an ecosystem.

Compiled by ISA Research

The ISA WINWire is available on the ISA website, To receive ISA WINWire or be removed from our distribution list, email with "Subscribe" or "Unsubscribe” in the subject box.

All information provided in this document is of a general nature and is not provided with any warranty as to its suitability to the circumstances of each individual business. Readers and users are entirely and individually responsible for taking appropriate action with regard to the setting up of such services and for the consequences of such actions. As per Copyrights Act, 1957 (“Act”) : Publishing articles which contain extracts from other works and providing the source of such extracts will not be an act of infringement of copyrights.

Copyright © 2007, India Semiconductor Association

India Semiconductor Association
Head office: UNI Building, Millers Tank Bund Road, Bangalore - 560 052 India Phone: +91 80 4147 3250 Facsimile: +91 80 4122 1866
New Delhi office: DBS Business Centre, First Floor World Trade Tower, Barakhamba Lane Connaught Place, New Delhi - 110 001 India