ISA WINWire January 24 - January 28 2011

Ranks of leading-edge chip foundries dwindle, says iSuppli

Source: Jessie Shen, Digitimes , January 24 2011 www.digitimes.com/

By the end of 2011, there may be only three remaining sources for high-volume and leading-edge semiconductor foundry manufacturing: Taiwan Semiconductor Manufacturing Company (TSMC), Globalfoundries and Samsung Electronics, according to IHS iSuppli. The most-advanced CMOS (complementary metal-oxide semiconductors) semiconductor process technologies now are at the 22nm to 20nm level, IHS iSuppli said. Several other foundries, including United Microelectronics Corp. (UMC) and Semiconductor Manufacturing International Corporation (SMIC), will be capable of providing near-leading-edge foundry manufacturing in high volume, at the 32nm and 28nm nodes.

Supply chain responsiveness: the top competitive advantage for fabless semiconductor companies?

Source: The 21st Century Supply Chain, January 24 2011 http://blog.kinaxis.com

The semiconductor industry has experienced rapid growth over the past few decades driven by leaps in innovation. To meet demand for specialized application devices, US based semiconductor firms realized they needed to become more agile and focus more resources on product development, which was their key point of differentiation. The innovations in chip design and the ever shorter product life cycles were making manufacturing ever more complex, which the semiconductor companies recognized was not their key differentiator. Having started outsourcing wafer fabrication in the 1960’s, by the early 1990’s most semiconductor companies had outsourced the bulk of their production to third-party foundries, which allowed fabless semiconductor firms to focus their resources on creating new, industry-changing products.

Electronics contract manufacturing market growth slows in 2011

Source: Anke Schröter, evertiq, January 24 2011 www.evertiq.com

The contract electronics industry, consisting of the electronics manufacturing services (EMS) and original design manufacturing (ODM) segments, will finish 2011 with revenue of USD 376.7 billion, up from USD 347.3 billion in 2010. Revenue will continue to rise at annual rates between 9 - 7% during the following years, reaching USD 472.3 billion in 2014. "The contract manufacturing industry in 2011 is grappling with reduced profit margins for certain consumer-oriented products because of intensified competition for new business. EMS and ODM providers with exposure to these areas have been hardest hit, while others with a more balanced end-market portfolio have fared much better", said Thomas J. Dinges, CFA, principal analyst for outsourced electronics manufacturing at IHS.

India's mobile phone users grow to 729.57 mn

Source: iGovernment.in, January 25 2011 www.igovernment.in

India added 22.88 million mobile phone subscribers in November, taking the total number of cellular users to 729.57 million till November 30, 2010, official data revealed on Tuesday. According to the Telecom Regulatory Authority of India (TRAI), the wireless phone user base grew 3.24 per cent to 729.57 million in November last year, from 706.69 million in the previous month. With this the total telephone subscriber base in the country, both wireless and wireline, touched 764.76 million. The total telephone density reached 64.34 per cent. The growth in India's wireless phone category was led by Vodafone Essar with an addition of 3.13 million users, 13.66 per cent of the net addition in November 2010, taking its user base to 121.16 million.

Tech takeaways from Obama's State of the Union

Source: EETimes, January 26 2011 www.eetimes.com

Excerpts from U.S. President Barack Obama's third State of the Union address before Congress, in which he emphasized science, technology and engineering more than any State of the Union in recent memory. U.S. President Barack Obama's third State of the Union address before Congress Tuesday (Jan. 25) was heavy on references to science, technology and engineering—perhaps more so than any State of the Union in years.

 

SIA sends wish list to Obama

Source: Mark LaPedus, EETimes, January 26 2011 www.eetimes.com

The U.S. Semiconductor Industry Association (SIA) said that it was encouraged by President Obama’s State of the Union address. The SIA encourages Congress and the Administration to work together to provide long-term federal funding commitments for research and education as well as reform of U.S. tax, regulatory, and workforce policies to bolster economic recovery. According to the SIA, Congress and the Administration must take the following steps:

'India presents fantastic opportunities for U.S. firms'

Source: SiliconIndia, January 27 2011 www.siliconindia.com

With India presenting "fantastic opportunities" for American companies in infrastructure development, the U.S. is making it a priority to help private sector help meet India's growing needs, according to a senior official. "India presents fantastic opportunities for U.S. companies to provide the goods and services needed to build its railroads, airports, power plants, and fibre optic cables to facilitate India's rise," Assistant Secretary of State for South Asia Robert Blake said. Speaking on "India: The Rise of an Economic Power" at Syracuse University, Syracuse, New York, he held out an assurance "that U.S. is making it a priority to work with our private sector to give them the opportunities to help meet India's growing needs."

 

IC content in electronic systems set to rise

Source: Dylan McGrath , EE Times, January 27 2011 www.eetindia.co.in

IC Insights Inc. reports that semiconductor content in electronic systems hit a record high of 25.4 per cent in 2010, which could further rise in view of the projected increase in IC average selling prices in 2011 and 2012. The semiconductor industry posted a record high dollar content in electronic systems of 25.4 per cent in 2010, says IC Insights. The market research firm further predicts that the percentage of semiconductor content in electronic systems sales will continue to rise as a result of the projected increase in semiconductor average selling prices (ASPs) in 2011 and 2012.

IIMB-Intel tie up soon to promote Next Big Idea

Source: The Economic Times, : January 27 2011 www.ibef.org

The Indian Institute of Management Bangalore (IIMB) on Monday announced a new initiative, Next Big Idea, aimed at fostering greater entrepreneurial growth across the country. IIMB will partner with global chip maker Intel and the Department of Science and Technology (DST) to nurture innovative ideas culled from business plan competitions until they can be turned into sustainable businesses. “No idea is a bad idea, this initiative is part of our strategy to building the entrepreneurial ecosystem”, said K Kumar, chairperson, NS Raghavan Center for Entrepreneurial Learning, IIMB.


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ISA Research
research@isaonline.org

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