Session plan & Presentations  



Day 1 : Thursday, February 14, 2013

ESDM-2020: Product Innovation, Global Collaboration & Policy Initiatives
Abstract: As India prepares to create the USD 400 billion domestic electronics industry, it is clear that “business as usual” cannot help us reach there.
  • The Indian ESDM ecosystem cannot depend on vertical growth alone.
  • Innovation in service models is not enough. We need to invent, innovate, improvise, and most of all, create IP within the country, to gain a bigger and more profitable slice of the global market.
  • Indian innovators must leverage the large market for Made-in-India solutions in several emerging economies.
  • The electronics industry is inherently global, and India can no longer work in an isolated environment. Global collaboration and co-creation hold the key to building world-class products that meet international standards.

It is clear from this that the three most significant factors of the Indian growth story in the years to come are product innovation, global collaboration and policy initiatives.



8.00  to 9.30 am                                              Registration

9.30  to 11.00  am

Inauguration and release of IESA Member Directory 2013

T.V. Mohandas Pai
Chairman, Manipal Global Education

Shri Partha Chatterjee
Minister for IT & Industries, Govt. of West Bengal
Dr. Ajay Kumar IAS
Joint Secretary, Dept. of Electronics & Information Technology, Govt. of India

Shri ISN Prasad IAS
Principal Secretary, DIT, BT&ST, Govt. of Karnataka

J. Parthasarathy
Director, Software Technology Parks of India

Dr. Satya Gupta
Chairman, IESA

PVG Menon
President, IESA
11.10 to 11.30 am Coffee/ Tea Break
11.30 to 12.00  noon

Keynote address 1

Lip-Bu Tan
CEO Cadence & Chairman, Walden International


Topic: Success Strategies for the India Semiconductor Industry
Abstract: As an one of the earliest VC investors in emerging economies,  Lip-Bu Tan has participated in the growth of the semiconductor industry in many countries. Tan is very  passionate about the industry and understands the confluence of factors that impact success. He advises government and industry organizations on semiconductor strategy and will  share his observations and ideas for growing the India  semiconductor industry.

12.00 to 12.30 pm Keynote address 2

Graham Budd

Topic: Global Innovation by Global Collaboration
Abstract: Graham Budd is the Chief Operating Officer of ARM, a global technology company specialising in the development of System-on-chip IP. Its microprocessor designs can be found in over 95% of the world’s mobile phones and in everything from sensors to servers. In his keynote, Graham will examine the opportunities for India in a fully connected world, what ARM has found to be successful in implementing its vision, and the importance of ecosystem and collaboration for success. As India looks to continue to grow its technology and semiconductor industry, Graham will examine how collaboration is important to help realise the opportunities that lie ahead.

12.30 to 01.00 pm

Keynote address 3

Tom Deitrich
Senior Vice President and General Manager - Digital Networking, Freescale Semiconductor
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Topic: The Heterogeneous Network Opportunity
Abstract: The exponential growth of smart connected devices and associated rise in the demand for bandwidth has created a mobile data tsunami, requiring regulators and service providers to accommodate dramatic data rate growth while enhancing coverage, controlling capital expenditure costs, and supporting the emergence of new technologies such as 4G. To do this, carriers are applying significant pressure on wireless infrastructure manufacturers to provide new generations of equipment capable of driving costs lower while supporting far more users and data traffic than ever before. For semiconductor providers, the mobile data tsunami presents significant challenges. But it also presents outstanding opportunities for chip vendors capable of providing the advanced silicon solutions that equipment OEMs demand. Recent advances in small cell technology have spawned new models for wireless networks, which make it more affordable to provide robust 4G wireless service across a broad range of use cases: from sparsely populated regions, to some of the most densely populated cities of the world. These advances in turn present exceptional opportunities for processor vendors capable of supporting these use cases.

This presentation will explore how “base station-on-chip” processor technologies are helping OEMs and carriers overcome challenges associated with the mobile data tsunami. Advanced heterogeneous multicore processing families based on a common architecture are delivering single-chip solutions designed to replace multiple functions traditionally performed on separate FPGAs, ASICs, DSPs. The resulting cost and power efficiency advantages are helping the wireless industry solve critical problems, while presenting significant opportunities for the semiconductor companies capable of delivering these next-generation, single -chip solutions.

1.00 to 1.45 pm Networking lunch
1.45 to 2.15 pm

Keynote address 4

Dr. Gary Patton
Vice President, Semiconductor Research and Development Center IBM
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Collaboration as a Way forward for Semiconductor Technology – Albany, New York Example
Abstract: Chip technology has had a profound impact on the world, entering almost all facets of modern life.   The catalyst for this has been the exponential growth in computing power – roughly fifteen orders of magnitude over the past 100 years.   The driving force for this change has been economics – smaller features result in better performance and cost/function, which in turn leads to more applications and larger markets.   Those economics and the requirements for technology scaling have both changed in a fundamental way over the past decade.  Traditional CMOS scaling, which has driven device performance during the past several decades, is approaching atomistic and quantum-mechanical boundaries.   Semiconductor R&D innovation has never been more critical for continuing the roadmap of technology scaling and improved power-performance. This requires long-term investment and collaboration in fundamental research for the future. Dr. Patton's keynote talk will discuss the role of collaboration as a way forward for further advancement of Semiconductor technology – In particular, IBM’s Albany Nanotechnology initiative will be discussed. The Albany Nanotech Center is a cutting edge Research and Development site consisting of a 300mm silicon facility, Advanced Packaging Center, and EUV Center of Excellence.  It represents a unique partnership between industry and government which has led to the growth of a large collaborative eco-system in which semiconductor manufacturers, equipment vendors, and materials suppliers are working together to provide early R&D technical solutions for 14nm and beyond technologies.

2.15 to 2.45 pm

Shri Sanjay Jaju IAS
Secretary IT, Govt. of Andhra Pradesh
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2.45 to 3.45 pm

Panel Session 1

Moderator :
Vishal Verma
Managing Director, Edgewood Networks

Ganapathy Subramaniam CEO, Cosmic Circuits

Rajendra Kumar Khare Chairman and Managing Director, SureWaves Innovations Pvt. Ltd.

Andrew Kaye
Head of Asia, William Blair & Company

Catalyzing Entrepreneurship & Innovation
Abstract:  Some of the most impactful innovations around the world are astonishing in their simplicity. While we all recognise the ingenuity of the innovation, we often fail to comprehend the amount of R&D that goes into unraveling that simple “tweak”. R&D is time consuming and unpredictable. Unlike funding other ventures backed by proven business plans, funding R&D, and therefore innovation, is fraught with grave risks. Is lack of funding keeping our Indian entrepreneurs from shaking up the world with their disruptive innovations? Are Indian VCs doing their bit to fuel innovation? How can Indian entrepreneurs create products that address unique local requirements and yet have a global appeal?

3.45 to 4.15 pm

Keynote address 5

Dr. Luc Van den hove President & CEO, IMEC Belgium
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Topic: The power of the new innovation model
Abstract: Luc Van den hove, president and CEO imec Next-generation mass consumer electronics, such as smart phones, tablets, ultrabooks, game consoles,… require systems-on-chip with ever more compute power and memory. These devices will continue to push Moore’s law beyond limits we didn’t dare to dream of 10 years ago. Extremely powerful compute and memory chips combined with heterogeneous integration of MEMS and sensors will guarantee the tremendous consumer requirements: connectivity everywhere and anytime, high quality and rich real-life experience. Also the application boundaries of semiconductors are expanding at a rapid pace. In recent years, the pharmaceutical and medical industry has discovered the potential of nanoelectronics. Merging biotechnology and advanced semiconductor technologies drives the future of medicine. It enables a preventive, predictive, personalized and participative healthcare system, aiming at solving the huge challenges of modern diseases such as cancer, diabetes, cardiac,… and at bringing affordable healthcare to everyone.

This evolution towards a sustainable society strongly depends on the availability of state-of-the-art semiconductor technology platforms. However, the cost of semiconductor R&D is increasing faster than the available R&D budgets. And also the complexity is increasing at an ever more rapid pace. Just look at the challenges for EUV and 450mm, two technologies which are crucial in the evolution of Moore’s law. So, to keep on fueling the semiconductor innovation engine, an open innovation platform bringing together the entire eco system (including IDMs, foundries, fabless and fablite companies, equipment and material suppliers,...) becomes indispensable. By optimally sharing knowledge, expertise, infrastructure and IP, this model will become the innovation engine of the next semiconductor wave fueling a sustainable society.

4.15 to 4.30 pm Coffee/ tea break

4.30 to 5.15 pm

Panel session 2

Moderator :
Vivek Sharma
Regional Vice President, Greater China and South Asia Region India Operations and Director India Design Center, STMicroelectronics

Dr. Ishwardutt Parulkar
CTO, Service Provider Access Group , Cisco Systems

Travis Karr
Vice President & General Manager, PMC-Sierra Inc.
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Dr. Suket Singhal Managing Director, Secure Meters
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Vasudevan Aghoramoorthy
Vice President, Semiconductor and System Solutions, Wipro Technologies

ESDM Product Development: Domestic & Global Company Experiences
Abstract: While India is well recognised as a global destination for fabless chip design, our contribution to global end-to-end product design and development is less than what it ought to be. Product development requires deep R&D pockets, proximity to end customers and the ability to quickly scale to meet growing demand. Also, conceptualizing new products that address the often hidden needs of consumers requires different skill sets.

During this session, industry leaders will share their product development stories, both in the international and domestic markets, and to present relevant case studies highlight the pitfalls to avoid and success factors to emulate while driving product development in India.


5.15 to 6.45 pm


Panel session 3

Moderator :
B V Naidu
Chairman and CEO, Sagitaur Ventures India Pvt. Ltd.

Shri Susanta Majumdar IAS, Secretary, IT&E Dept, Govt. of West Bengal
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Shri P. Nandakumar
Executive Director, Kerala State Industrial Development Corporation (KSIDC), Govt. of Kerala
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State Governments

6.45 to 8.00 pm

Panel session 4

Moderator :
Tony Vanden Zegel
Managing Director, IMEC India

Rudi Cartuyvels
Senior Vice President R&D, IMEC
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Subramani Kengeri
Vice President, Advanced Technology Architecture, GLOBALFOUNDRIES
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Ateendra Kumar Singh Research Engineer, IMEC India
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Bert Gyselinckx
General Manager Holst Centre/IMEC - Program Director HUMAN++, IMEC
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IMEC Technology Forum
Abstract: As a world-leading research institute in nano electronics, imec organizes annually the Imec Technology Forum (ITF) series across the world. For the first time, an ITF session will be organized at the IESA Vision Summit.

During its 29 years of existence, imec has played a prominent role in driving future technology roadmaps and development in the global semiconductor industry. Imec aims at bringing semiconductor-based technology solutions to the global industry to solve key societal challenges in domains such as healthcare, energy, urbanization and mobility. Imec has a global network of partners including all the leading IDMs, system houses, foundries, equipment and material suppliers, fabless and fablite companies, but also medical device manufacturers, energy companies, research institutes and universities. With its ITFs, imec aims at bringing key players together to discuss roadmaps, advances on future technologies and future systems that will play a crucial role in staying at the forefront of semiconductor-based innovations.

At ITF2013 India, participants will get early insight in market trends, evolutions and latest breakthroughs in semiconductor technologies, hyper spectral imaging and wearable diagnostics and health monitoring systems. Participants will witness how imec accelerates innovation through global collaboration. How imec confronts different ideas and opinions, and combines different technologies, to create sustainable solutions for our information and communication society and to make a sustainable healthcare system.

8.00 to 8.30 pm Keynote address 6

Dr. Martin Scott
CTO and Senior Vice President, Rambus Inc.

Thinking Big to Focus Innovation
Abstract: The opportunities for innovation in the trillion dollar electronics industry have never been more exciting, despite the ever increasing complexity and costs of keeping up with Moore’s Law. In a fascinating paradox of how economic value is created, the semiconductor and electronic systems industries find themselves striving for different goals within an increasingly complex worldwide value chain. This paradox creates great opportunity to innovate. Economic forces in deep sub-micron semiconductor manufacturing drive optimization and replication of standard components for lower cost. In addition, lithography complexity and the physical limits of materials are driving unprecedented levels of abstraction between design intent and physical realization. This talk will explore the ecosystem of intellectual property, HW/SW interfaces, interoperability standards, and connections which need to be dynamically managed in new ways to unlock the value that fuels innovation.

8.30 pm onwards

Technovation Awards 2012 & CEO Networking Dinner

Day 2 : Friday, February 15, 2013

9.30 to 11.00 am

Panel session 5

Moderator : Ajai Chowdhry Founder HCL and Former Chairman, HCL Infosystems Ltd.

Shri Arun Maira
Member, Planning Commission, Govt. of India

Prof. S V Raghavan Scientific Secretary, Office of the Principal Scientific Adviser to Govt. of India
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Theme perspective from the policy-makers

11.00 to 11.15 am

Coffee/ tea break
11.15 to 12.00 pm

Panel session 6

Moderator : PVG Menon
President, IESA

Sanjay Nayak
CEO & MD, Tejas Networks
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Ulf Schneider
Managing Director, Lantiq Asia Pacific Pte. Ltd and President, Singapore Semiconductor Industry Association (SSIA)
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Analysing World-wide Policy Framework Implementation to Promote Local ESDM
Abstract: What makes China a leader in electronics manufacturing? How did the world’s biggest electronics and semiconductor companies survive their tough years? What has been the role of the Government in making countries like Mexico and Taiwan favourable destinations for ESDM? More importantly, what lessons can India draw from these international experiences?

The recent slew of initiatives, both at the national and state level, underline the Indian Government’s keen interest in growing ESDM industry. In fact, ESDM is considered by many states as the new sunrise sector driving employment and growth for their people. During this session, senior members from the government and the industry will discuss how international policy frameworks and implementation strategies influence Indian policy making.

12.00 to 1.30 pm

Panel session 7

Moderator : Dr. Satya Gupta
Chairman, IESA

Rashmi Urdhwareshe Senior Deputy Director, Automotive Research Association of India (ARAI)
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John Chilton
Senior Vice President, Marketing and Strategic Development, Synopsys Inc.
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Venkat Kodavati
Co-founder and VP Engineering of Posedge Corporation
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Prof. D B Phatak Chairprofessor, Dept. of Computer Science & Engineering, IIT Bombay

Arindam Sen
CEO, Advanced Micronic Devices Limited

B M Vyas
Deputy General Manager, Yadav Measurement Pvt. Ltd.
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Electronics for masses: Innovative products addressing India’s critical needs
Abstract: India being such a vast country with large population it is becoming very difficult to scale solutions for the important domains such as Education, Health Care, Energy, to name a few. Electronics can fundamentally transform the way solutions can be provided to masses for these important needs. The use of Electronics technology as catalysts for addressing general and unique needs of country presents a whole new opportunity for the ESDM sector – one in which domestic players have a definite advantage as they are closer to the users of technology. Also in certain areas due to unique needs, India specific standards can play a major role in domestic product development and manufacturing. Solutions in these areas can’t be done alone and collaboration between domestic companies and global companies can play a huge role.  This session will discuss these opportunities, solutions and experiences for Electronics products for masses.

1.30 to 2.00 pm